%0 Conference Paper %F Oral %T Low stress polyimide multilayers integration for flexible substrate %+ Service Techniques et Équipements Appliqués à la Microélectronique (LAAS-TEAM) %+ Équipe NanoBioSystèmes (LAAS-NBS) %A Charlot, Samuel %A Castagnola, Valentina %A Descamps, Emeline %< avec comité de lecture %Z Rapport LAAS n° 14061 %B Smart System Integration %C Vienne, Austria %P 4p. %8 2014-03-26 %D 2014 %Z Engineering Sciences [physics] %Z Engineering Sciences [physics]/Micro and nanotechnologies/MicroelectronicsConference papers %X Materials integration in flexible substrate to do foldable and bending MEMS or electronics devices seems to be required for a lot of applications. That's why; we present here a simple fabrication process flow to make polyimide (PI) devices easily peelable from a rigid support host. Besides the PI flexible device keeps its original aspect thanks to the hygroscopic character of the carrier [1]. The advantage of this process is its simplicity of implementation on a support host without sacrificial layer. It makes it possible to control roughness, deposited thickness, and also to limit the constraints between various materials. %G English %2 https://laas.hal.science/hal-01869404/document %2 https://laas.hal.science/hal-01869404/file/low%20stress%20flexible%20substrate.pdf %L hal-01869404 %U https://laas.hal.science/hal-01869404 %~ UNIV-TLSE2 %~ UNIV-TLSE3 %~ CNRS %~ INSA-TOULOUSE %~ LAAS %~ UT1-CAPITOLE %~ LAAS-NBS %~ LAAS-TEAM %~ LAAS-MICRO-NANO-BIO-TECHNOLOGIES %~ INSA-GROUPE %~ TOULOUSE-INP %~ UNIV-UT3 %~ UT3-INP %~ UT3-TOULOUSEINP