Low cost integration of multilevel lab-on-a-chip using a new generation of dry film photoresists - LAAS - Laboratoire d'Analyse et d'Architecture des Systèmes
Communication Dans Un Congrès Année : 2014

Low cost integration of multilevel lab-on-a-chip using a new generation of dry film photoresists

Résumé

We present the use of a novel dry film photoresist DF-1050 (EMS) for the integration of multilevel microfluidic systems. We showed that high resolution and high aspect ratio (7:1) can be achieved for free standing structures. We proved also that the dry film autofluorescence level is compatible with most of lab-on-a-chip applications and established the biocompatibility of this dry film. Ultimately, we demonstrated that this low-cost material combined with multilevel lamination technology would allow introducing massively 3D microfluidic in lab-on-a-chip devices.
Fichier principal
Vignette du fichier
Low cost integration of multilevel lab-on-a-chip using a new generation of dry film photoresists.pdf (1.22 Mo) Télécharger le fichier
Origine Fichiers produits par l'(les) auteur(s)
Loading...

Dates et versions

hal-01875311 , version 1 (02-10-2018)

Identifiants

  • HAL Id : hal-01875311 , version 1

Citer

Rémi Courson, Sébastien Cargou, Véronique Conédéra, Marc Fouet, Anne Marie Gué. Low cost integration of multilevel lab-on-a-chip using a new generation of dry film photoresists. Smart Systems Integration, Mar 2014, Vienne, Austria. 8p. ⟨hal-01875311⟩
226 Consultations
54 Téléchargements

Partager

More