Frequency Based Method Investigation to Extract an ESD Protection Dynamic SPICE Model from TLP Measurements - LAAS - Laboratoire d'Analyse et d'Architecture des Systèmes
Article Dans Une Revue IEEE Transactions on Electromagnetic Compatibility Année : 2022

Frequency Based Method Investigation to Extract an ESD Protection Dynamic SPICE Model from TLP Measurements

Résumé

In order to ensure reliability of systems early in the design phase, it is becoming crucial to have models able to predict the behavior of systems exposed to ElectroStatic Discharge (ESD). This is an increasing necessity since the number of embedded electronic products is growing and since they are employed in applications where people's safety is a requirement, such as automotive and aeronautic applications. Until now, quasi-static models of protection devices have succeeded in providing fairly good results in failure predictions (mainly hard failures). Today, the increased frequency range of such devices requires dynamic models able to reproduce their transient behavior. In this paper, we investigate if conventional methods for modeling linear devices, generally used in the frequency domain, could be used to obtain an equivalent frequency model for ESD protection devices, which exhibit non-linear behavior. A methodology to extract an ESD protection SPICE model from Transmission Line Pulse (TLP) measurements to address transient and frequency simulation is proposed and detailed. We demonstrate that, in well-defined conditions, such frequency models can give accurate results to predict overshoots related to protection device triggering delays. Validation of the models is performed under TLP and Human Metal Model (HMM) conditions on three off-the-shelf devices.
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Dates et versions

hal-03408285 , version 1 (29-10-2021)

Identifiants

Citer

Fabien Escudié, Fabrice Caignet, Nicolas Nolhier, Alexandre Boyer. Frequency Based Method Investigation to Extract an ESD Protection Dynamic SPICE Model from TLP Measurements. IEEE Transactions on Electromagnetic Compatibility, 2022, 64 (1), pp.47 - 57. ⟨10.1109/TEMC.2021.3106770⟩. ⟨hal-03408285⟩
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