%0 Conference Proceedings %T Copper Large-scale Grain Growth by UV Nanosecond Pulsed Laser Annealing %+ SCREEN-LASSE %+ Équipe Matériaux et Procédés pour la Nanoélectronique (LAAS-MPN) %A Tabata, Toshiyuki %A Raynal, Pierre, - Edouard %A Rozé, Fabien %A Halty, Sébastien %A Thuries, Louis %A Cristiano, Fuccio %A Scheid, Emmanuel %A Mazzamuto, Fulvio %< avec comité de lecture %Z Rapport LAAS n° 21352 %( 2021 IEEE International Interconnect Technology Conference (IITC) %B IEEE International Interconnect Technology Conference (IITC 2021) %C Kyoto (virtual), Japan %8 2021-07-06 %D 2021 %R 10.1109/IITC51362.2021.9537312 %K laser anneal %K Back End Of Line %K grain growth %K copper %Z Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics %Z Engineering Sciences [physics]/MaterialsConference papers %X UV nanosecond pulsed laser annealing (UV NLA) enables both surface-localized heating and short timescale high temperature processing, which can be advantageous to reduce metal line resistance by enlarging metal grains in lines or in thin films, while maintaining the integrity and performance of surrounding structures. In this work UV NLA is applied on a typical Cu thin film, demonstrating a mean grain size of over 1 μm and 400 nm in a melt and sub-melt regime, respectively. Along with such grain enlargement, film resistivity is also reduced. %G English %2 https://laas.hal.science/hal-03412643/document %2 https://laas.hal.science/hal-03412643/file/2021_IITC_Toshi%20Tabata.pdf %L hal-03412643 %U https://laas.hal.science/hal-03412643 %~ UNIV-TLSE2 %~ UNIV-TLSE3 %~ CNRS %~ INSA-TOULOUSE %~ LAAS %~ UT1-CAPITOLE %~ LAAS-MPN %~ LAAS-MICRO-NANO-BIO-TECHNOLOGIES %~ INSA-GROUPE %~ TOULOUSE-INP %~ UNIV-UT3 %~ UT3-INP %~ UT3-TOULOUSEINP