On the Correlation between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level - Part I
Résumé
Near-Field Scan Immunity is a powerful technique to identify the root-cause of failures produced during radiated immunity tests at the integrated circuit (IC) and printed circuit board (PCB) levels. However, a prediction method of the radiated immunity level from near-field scan immunity results is still lacking. This type of method would help board designers to anticipate risks of radiated immunity non-compliance related to PCB directly after a near-field scan campaign. This two-part paper addresses this issue. In the first part, the equivalence between far-field and near-field coupling on a microstrip line is discussed in order to derive an estimator of the far-field induced voltage from near-field scan results.
Domaines
Electronique
Fichier principal
Boyer 2021 - Correlation RI NFSI_PartI _ final.pdf (1.15 Mo)
Télécharger le fichier
Origine | Fichiers produits par l'(les) auteur(s) |
---|