The present work introduces a simple and rapid process for the fabrication of MEMS resonators with electrostatic
actuation and capacitive detection. Gold thermocompression is used to anchor the free-standing structure, provide
electrical connections and seal the chip to protect the structure to be released during wet etching, in a single step. The
additional advantage of this process is the ability to simply adjust the gap of the parallel-plate capacitor through the
thickness of electroplated gold. Squeeze damping is reduced by fabricating devices with increasing gaps.