Communication Dans Un Congrès Année : 2024

Investigation of the enlargement of Ru grains and failure modes analysis in microsecond UV laser annealing

Résumé

Interconnects based on Ru has been considered as a promising candidate to replace Cu-based interconnects for the future technology nodes thanks to its low bulk resistivity (ρ), its short electron mean free path (e-MFP) and the possibility to have a barrier-less integration. In this work, we demonstrate that μs UV Laser Annealing (UV- LA) is an interesting process strategy to reduce the metal line resistance by enlarging grains in thin Ru films. A method based on numerical simulations has been proposed to optimize the LA conditions to lower the Ru film ρ close to the bulk one, while avoiding the apparition of structural damages such as wrinkles or buckling.

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Dates et versions

hal-05202707 , version 1 (07-08-2025)

Identifiants

Citer

Zeinab Chehadi, Richard Daubriac, Lu Lu, Karim Huet, Zsolt Tokei, et al.. Investigation of the enlargement of Ru grains and failure modes analysis in microsecond UV laser annealing. 2024 IEEE International Interconnect Technology Conference (IITC), Jun 2024, San Jose, United States. pp.1-3, ⟨10.1109/IITC61274.2024.10732322⟩. ⟨hal-05202707⟩
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