Compact thermal modelling for fast simulating consequences of pump defect: application to power module with double efficient cooling - LAAS - Laboratoire d'Analyse et d'Architecture des Systèmes Access content directly
Conference Papers Year : 2018

Compact thermal modelling for fast simulating consequences of pump defect: application to power module with double efficient cooling

Abstract

Compact thermal modelling can provide useful tools for electronic systems designers. Indeed, the generation of simplified but accurate thermal models enables to reduce the number of 3D thermal simulations with high complexity and expensive computation time. Another benefit is the possibility for device manufacturers to provide systems suppliers with extended datasheets in the form of Compact Thermal Model (CTM) without revealing the device structure or used materials. The CTM can be applied to multi-chips systems and it is auto-adaptive to boundary conditions change. In this paper, CTM methodology is defined for an efficient power module structure with double side cooling. The extracted CTM is used to investigate cooling pump defects in the design phase of the inverter. The results are compared with a 3D thermal model using Computational Fluid Dynamics software (6SigmaET).
Fichier principal
Vignette du fichier
Therminic2018_Cassou_LAAS.pdf (1.11 Mo) Télécharger le fichier
Origin Files produced by the author(s)
Loading...

Dates and versions

hal-02613655 , version 1 (20-05-2020)

Identifiers

Cite

Anais Cassou, Patrick Tounsi, Jean-Pierre Fradin. Compact thermal modelling for fast simulating consequences of pump defect: application to power module with double efficient cooling. THERMINIC 2018, Sep 2018, Stockholm, Sweden. pp.1-5, ⟨10.1109/THERMINIC.2018.8593317⟩. ⟨hal-02613655⟩
53 View
19 Download

Altmetric

Share

Gmail Mastodon Facebook X LinkedIn More