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Conference Papers Year : 2022

Failure Mode Analysis in Microsecond UV Laser Annealing of Cu Thin Films

Louis Thuries
  • Function : Author
  • PersonId : 1115627
Fabien Rozé
  • Function : Author
  • PersonId : 1115625
Toshiyuki Tabata
  • Function : Author
  • PersonId : 1115624
Fulvio Mazzamuto
  • Function : Author
  • PersonId : 1115629

Abstract

The need of surface-localized thermal processing is strongly increasing especially w.r.t three-dimensionally (3D) integrated electrical devices. UV laser annealing (UV-LA) technology well addresses this challenge. Particularly UV-LA can reduce resistivity by enlarging metallic grains in lines or thin films, irradiating only the interconnects for short timescales. However, the risk of failure in electrical performance must be correctly managed, and that of UV-LA has not been deeply studied yet. In this work microsecond-scale UV-LA is applied on a stack comparable to an interconnect structure (dielectric/Cu/Ta/SiO2/Si) in either melt or sub-melt regime for grain growth. The failure modes such as (i) Cu diffusion into SiO2, (ii) O incorporation into Cu, and (iii) intermixing between Cu and Ta are investigated.

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Dates and versions

hal-03795894 , version 1 (04-10-2022)

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Rémi Demoulin, Richard Daubriac, Louis Thuries, Emmanuel Scheid, Fabien Rozé, et al.. Failure Mode Analysis in Microsecond UV Laser Annealing of Cu Thin Films. IEEE International Interconnect Technology Conference (IITC) 2022, Jun 2022, San José, California, United States. ⟨10.1109/iitc52079.2022.9881308⟩. ⟨hal-03795894⟩
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