A simple process for the fabrication of parallel-plate electrostatic MEMS resonators by gold thermocompression bonding
Abstract
The present work introduces a simple and rapid process for the fabrication of MEMS resonators with electrostatic
actuation and capacitive detection. Gold thermocompression is used to anchor the free-standing structure, provide
electrical connections and seal the chip to protect the structure to be released during wet etching, in a single step. The
additional advantage of this process is the ability to simply adjust the gap of the parallel-plate capacitor through the
thickness of electroplated gold. Squeeze damping is reduced by fabricating devices with increasing gaps.
Domains
Engineering Sciences [physics]
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PosterMEMS2023.pdf (1.04 Mo)
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AsimpleProcess.pdf (513.83 Ko)
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| Format | Figure, Image |
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| Origin | Files produced by the author(s) |
| Origin | Files produced by the author(s) |
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