On the Correlation between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level – Part II - LAAS - Laboratoire d'Analyse et d'Architecture des Systèmes Access content directly
Journal Articles IEEE Transactions on Electromagnetic Compatibility Year : 2022

On the Correlation between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level – Part II

Alexandre Boyer
Nicolas Nolhier
Sonia Ben Dhia

Abstract

The work presented in this two-part paper focuses on a prediction method of the radiated susceptibility of integrated circuit and printed circuit board from near-field scan injection, in order to anticipate risks of non-compliance due to design weakness. In Part I, a worst-case estimator of the far-field induced voltage on a PCB trace was proposed. Based on it, an estimator of the radiated susceptibility of a printed-circuit board based on near-field scan results is derived and validated through two validation case studies.

Domains

Electronics
Fichier principal
Vignette du fichier
FINAL VERSION.pdf (1.15 Mo) Télécharger le fichier
Origin : Files produced by the author(s)

Dates and versions

hal-03681022 , version 1 (30-05-2022)

Identifiers

Cite

Alexandre Boyer, Nicolas Nolhier, Fabrice Caignet, Sonia Ben Dhia. On the Correlation between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level – Part II. IEEE Transactions on Electromagnetic Compatibility, 2022, 64 (5), pp.1493 - 1505. ⟨10.1109/TEMC.2022.3172601⟩. ⟨hal-03681022⟩
26 View
42 Download

Altmetric

Share

Gmail Facebook X LinkedIn More