Low stress polyimide multilayers integration for flexible substrate - LAAS - Laboratoire d'Analyse et d'Architecture des Systèmes Access content directly
Conference Papers Year : 2014

Low stress polyimide multilayers integration for flexible substrate

Abstract

Materials integration in flexible substrate to do foldable and bending MEMS or electronics devices seems to be required for a lot of applications. That's why; we present here a simple fabrication process flow to make polyimide (PI) devices easily peelable from a rigid support host. Besides the PI flexible device keeps its original aspect thanks to the hygroscopic character of the carrier [1]. The advantage of this process is its simplicity of implementation on a support host without sacrificial layer. It makes it possible to control roughness, deposited thickness, and also to limit the constraints between various materials.
Fichier principal
Vignette du fichier
low stress flexible substrate.pdf (106.24 Ko) Télécharger le fichier
Origin : Files produced by the author(s)
Loading...

Dates and versions

hal-01869404 , version 1 (06-09-2018)

Identifiers

  • HAL Id : hal-01869404 , version 1

Cite

Samuel Charlot, Valentina Castagnola, Emeline Descamps. Low stress polyimide multilayers integration for flexible substrate. Smart System Integration, Mar 2014, Vienne, Austria. 4p. ⟨hal-01869404⟩
64 View
36 Download

Share

Gmail Facebook X LinkedIn More