On the Correlation between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level - Part I - LAAS - Laboratoire d'Analyse et d'Architecture des Systèmes Access content directly
Journal Articles IEEE Transactions on Electromagnetic Compatibility Year : 2022

On the Correlation between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level - Part I

Alexandre Boyer
Nicolas Nolhier
Sonia Ben Dhia

Abstract

Near-Field Scan Immunity is a powerful technique to identify the root-cause of failures produced during radiated immunity tests at the integrated circuit (IC) and printed circuit board (PCB) levels. However, a prediction method of the radiated immunity level from near-field scan immunity results is still lacking. This type of method would help board designers to anticipate risks of radiated immunity non-compliance related to PCB directly after a near-field scan campaign. This two-part paper addresses this issue. In the first part, the equivalence between far-field and near-field coupling on a microstrip line is discussed in order to derive an estimator of the far-field induced voltage from near-field scan results.

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Electronics
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Dates and versions

hal-03664433 , version 1 (11-05-2022)

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Alexandre Boyer, Nicolas Nolhier, Fabrice Caignet, Sonia Ben Dhia. On the Correlation between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level - Part I. IEEE Transactions on Electromagnetic Compatibility, 2022, 64 (4), pp.1230 - 1242. ⟨10.1109/TEMC.2022.3169183⟩. ⟨hal-03664433⟩
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